Xiphos Technologies Inc.

Products

Overview

XTI's signature technology is a series of miniature processing boards called Q-cards. They use logic-software hybrid computation to perform complex processing tasks at a small fraction of the power and weight of conventional processors.

Q-cards are generally used in conjunction with application-specific daughterboards which provide a broad range of interfacing options, connectors and other application-specific hardware.

Q6

Currently under development, the Q6 is the successor to the flight-qualified Q5. It retains the small form factor, low mass and power consumption of its predecessor, but provides a number of attractive new features.

More information (PDF)

The following Q6 board stack configurations are under development.

Q6-GP

The Q6-GP is the hardware underlying the Generic Payload Interface (GPI) under development for the CSA's ESM program. The Q6-GP consists of a Q6 and a GP daughterboard. The GPI has two primary functions: communications adapter and payload controller.

It has one primary purpose: to allow payload developers to focus on the payload itself, without being distracted by mission communications, processor development, or code optimization.

Q6-SAM

The Q6-SAM is an addressable I/O module with integrated power conditioning, scalable interface capacity, and the full capability of the Q6 for in-situ processing and conditioning of data as it is acquired. 'SAM' stands for Stackable Addressable Module, and it measures roughly 80 x 50 x 50 mm, increasing in height as additional I/O cards are added. The Q6-SAM will be commercially released in the fourth quarter of 2010.

Q5

Xiphos Technologies Inc. Q5

The business card-sized Q5 has been flight qualified and is currently in use in several operational spacecraft.

More information (PDF)

Q5-EDM

The Embedded Deployment Module (EDM) is a Q5 daughterboard that provides power, an SD card socket, 10/100 Mbps Ethernet, as well as analog and digital I/O, all in a PC/104 form factor. It measures 96 x 90 x 26 mm, has a mass of 78 g (94 g when combined with a Q5) and dissipates an average of 1.4 W (2.5 W including the Q5).

Simulink users can perform model-based development of real-time applications for the Q5-EDM using the 'Q5/Xenomai Embedded Real-time Target for Real-Time Workshop'.

Xiphos Technologies Inc. Q5

Q5-NET-DDK

The Q5-NET-DDK board stack includes a Q5 and two dautherboards: the Q5-Net card and the Q5 Development Daughterboard Kit (DDK).

The DDK is the ideal host platform for prototyping Q5-based software and logic applications; it provides power and easy access to Q5 digital and analog I/O lines and serial interfaces via screw-terminal blocks and DB9 connectors. The Q5-Net card provides 10/100 Mbps Ethernet, USB, and SD Card storage for rapid software development.

Simulink users can perform model-based development of real-time applications for the Q5-Net-DDK stack using the Q5/Xenomai Embedded Real-time Target for Real-Time Workshop.

Hybrid Processor Card (HPC)

Slightly larger than a Q5, the HPC measures 80 mm x 80 mm, has a mass of 50 g, and consumes less than 5 W of power.

Although it remains a highly versatile device, like all Q-cards, the HPC was designed with image processing in mind. For typical image processing applications, it benchmarks at similar performance to a 2.4 GHz Intel Core2 PC.

Xiphos Technologies Inc. HPC
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